To benefit from the maximum performance of the new ERmet ZDpro the usage of backdrilling is recommended. Decreasing via stub length and the related “stub effect“ by backdrilling significantly reduces the reflections and the overall BER (Bit Error Rate) of the connection.
ERmet ZDpro connectors are backwards mating compatible to ERmet ZD and ZDplus connectors.This means, that existing backplane designs don‘t need layout changes on the backplane side, if customers want to upgrade their daughtercards in the first step before upgrading the whole system. Of course the layout on the daughtercards has to be modified, if ERmet ZDpro receptacles are used.
- 2.5 mm wafer pitch
- Low-noise, dual-beam, leaf contacts
- Data rates of over 25 Gbit/s
- Excellent signal integrity
- Suitable for hot-swap applications
- 4.5 mm pitch between pairs