MicroSpeed 1.0 mm

The MicroSpeed SMT miniaturized, modular connector system, with transfer rates of up to 25 Gbit/s, was designed especially for telecommunications and data transmission devices. Board-toboard spacing of between 5 and 20 mm can be achieved using different heights. For differential data transmission several different signal-pair arrangements are possible. We achieve exceptional signal integrity using a design which features two signal and two shield contact rows.

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More Information

  • High signal integrity
  • EMC improved shielding (high interference-resistance / excellent EMC)
  • Blind-mate variants available
  • Automatic process capable
  • 5 to 20 mm stack heights
  • Data rates up to 25+ Gbit/s
  • High current rating up to 18 A of the power modules

Additional information

Brand

Orbitalum

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